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  1 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com 1.8mm round subminiature infrared led EAIST3224A0 features ? compatible with infrared and vapor phase r eflow solder process. ? low forward voltage ? good spectral matching to si photodetector ? pb free ? the product itself will remain within rohs compliant version. descriptions ? EAIST3224A0 is an infrared emitting diode in miniature smd package which is mol ded in a water clear plastic with spherical top view lens. ? the device is spectrally matched with silicon photodiode and phototransistor. applications ? pcb mounted infrared sensor ? infrared emitting for miniature light barrier ? floppy disk drive ? optoe lectronic switch ? smoke detector device selection guide part category chip material lens color EAIST3224A0 gaalas water clear
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 2 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com package dimensions notes: 1.all dimensions are in millimeters 2.tolerances unless dimensions 0.1mm absolute maximum ratings (ta=25 c ) 1 2 1 2 cathode anode 1 2
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 3 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com parameter symbol rating unit continuous forward current i f 100 ma peak forward current *1 i fp 1.0 a reverse voltage v r 5 v operating temperature t opr - 40 ~ + 85 c storage temperature t stg - 40 ~ + 100 c soldering temperature *2 t sol 260 c junction temperature t j 115 ? c thermal resistance junction (ambient mounted on pc - board padsize 16mm 2 each) r thja 400 ? c /w thermal resistance junction (soldering point , mounted on metal block) r thjs 300 ? c /w power dissipation at(or below) 25 free air temperature p d 200 mw notes: *1:i fp conditions -- pulse width Q 100 s and duty Q 1%. *2:soldering time Q 5 seconds. electro - optical characteristics (ta=25 c ) parameter symbol condition min. typ. max. unit rad iant intensity i e i f =20ma 7.0 14.0 -- mw/sr i f p = 150m a , pulse width Q 470 s ,duty Q 1% 50 100 -- peak wavelength p i f =20ma -- 850 -- nm spectral bandwidth ? i f =20ma -- 30 -- nm forward voltage v f i f =20ma 1.2 1.4 1.7 v i f p = 150m a , pulse width Q 470 s ,duty Q 1% 1.4 1.75 2.0 reverse current i r v r =5v -- -- 10 ua view angle 2 1/2 i f =20ma -- 35 -- deg typical electro - optical characteristics curves fig.1 forward current vs. fig.2 spectral distributio n
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 4 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com ambient temperature f ig.3 peak emission wavelength fig.4 forward current ambient temperature vs. forward voltage typical electro - optical characteristics curves fig. 5 radiant intensity vs. 790 0 20 40 60 80 100 890 850 810 830 870 930 910 950 i f =20ma ta=25 c 75 -25 800 0 825 850 25 50 875 900 100 0 10 10 1 10 2 3 10 4 1 4 6 8 2 3 5 7 0 20 40 60 80 100 120 0 20 40 60 80 100 t amb - ambient temperature (c) i f - forward current (ma)
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 5 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com forward current fig. 6 relative radiant intensity vs. angular displacement precautions for use 1. over - current - proof 25 1 1.2 1.4 1.6 50 75 100 120 i f =20ma 0 30 60 90 -90 -60 -30 0 0.0 0.2 0.4 0.6 0.8 1.0 relative radiant intensity view angle(degree) 0 20 40 60 80 100 0 20 40 60 80 ie-radiant intensity(mw/sr) if-forward current (ma)
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 6 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com customer must a pply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or less and 90%rh or less. 2.3 the leds should be used within a year. 2.4 after opening the package, the leds should be kept at 30 or less and 6 0%rh or less. 2.5 the leds should be used within 168 hours (7 days) after opening the package. 2. 6 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 605 for 48 hours. 3. soldering condition 3.1 pb - free solder temperature profile 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4. soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 7 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com more intervals, and do sold ering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5. repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double - head soldering iro n should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing.
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 8 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com package dimensions carrier tape dimensi ons unit: mm
data sheet 1 .8mm round subminiature infrared led EAIST3224A0 9 copyright ? 2010, everlight americas inc . all rights reserved. release date : 5/2 8/ 201 3 . issue no: 1 rev : 1 www.everlightamericas.com packing procedure label form specification cpn: customers production number p/n : production number qty: packing quantity cat: ranks hue: peak wave length ref: reference lot no: lot number notes 1. above specification may be changed without notice. everlight americas will reserve authority on material change for above specification. 2. when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. everlight americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in t hese specification sheets. 3. these specification sheets include materials protected under copyright of everlight americas corporation. please dont reproduce or cause anyone to reproduce them without everlight americas s consent. aluminum moistue-proof bag label desiccant label


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